Sponsor
Ministry of Transportation (MTO)
Program
Highway Infrastructure Innovations Funding Program (HIIFP)
Description
The objective of HIIFP is to encourage Ontario’s academic community to pursue research projects that contribute to generating solutions to current technical challenges encountered by MTO in the construction and maintenance of the provincial highway infrastructure network. These research projects are funded through HIIFP.
A diverse range of specific research topics have been developed by MTO that outline the background of the research requirement, the challenge or problem to be addressed, and the anticipated outcome and/or research deliverables. Review the 2024-25 HIIFP Program Guide for complete details.
The HIIFP for fiscal year 2025-26 invites Ontario's eligible institutions to submit research proposals. Eligible institutions may select one or more research topics provided by MTO or propose their own topics (i.e., open research topics).
Eligibility
All of Ontario’s 23 public universities and 24 colleges are eligible for funding under the HIIFP. The Principal Researcher must be a member of the faculty (full or part-time) at the sponsoring institution.
Indirect Costs
25%
Deadlines
If College-level review is required, your College will communicate its earlier internal deadlines.
| Type | Date | Notes |
|---|---|---|
Internal Deadline | Please submit your application, along with an OR-5 Form to research.services@uoguelph.ca. | |
External Deadline | Application package due to MTO by Princial Researcher. |
How to Apply
Completed application packages (including all supporting documentation) must be received by this stipulated deadline date. An electronic PDF copy of the complete application package shall be submitted to the HIIFP Coordinator (HIIFP@ontario.ca) with the Subject Line: HIIFP Application Package. Subsequent to emailing the HIIFP application package to the HIIFP Coordinator, the applicant (e.g., Principal Researcher) shall receive a return email confirming receipt of the HIIFP application package.